Tag Archives: Computer Chips

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MediaTek Dimensity 9400

MediaTek Introduces the Dimensity 9400: A 3nm Powerhouse for Smartphones

MediaTek has officially launched the Dimensity 9400 (trendforce.com), its latest flagship processor designed for high-end smartphones. This new system-on-chip (SoC) offers powerful performance, improved efficiency, and advanced AI capabilities. MediaTek is continuing its long-standing collaboration with Arm, avoiding the switch to RISC-V, which some competitors are exploring.

Image credit: MediaTek (Dimensity 9400)
Image credit: MediaTek (Dimensity 9400)

Performance Boost and Power Efficiency
The Dimensity 9400 brings a significant upgrade in performance (beebom.com) over its predecessor, the Dimensity 9300. This octa-core processor consists of one Arm Cortex-X925 core running at over 3.6GHz, three Cortex-X4 cores at 3.6GHz, and four Cortex-A720 cores at 3.3GHz. With this “all big core” design, MediaTek has focused on maximizing power. Built on TSMC’s 3nm process node, the chip delivers up to 40% more power efficiency compared to the previous 4nm generation.

Enhanced AI Capabilities
Artificial Intelligence is a core feature of the Dimensity 9400. It includes an eighth-generation neural processing unit (NPU) that boosts machine learning tasks by 80%, making it faster and more efficient. MediaTek also introduced the Dimensity Agentic AI Engine, which connects applications to various AI models and hardware acceleration, supporting both on-device and cloud-based AI tasks.

Graphics and Connectivity Improvements
On the graphics side, the processor includes a 12-core Arm Immortalis G925 GPU. It offers 41% more performance and 44% better power savings. Additionally, MediaTek upgraded its Wi-Fi and Bluetooth combo chip. Now it delivers faster data speeds and extended wireless coverage, with a focus on improving overall device efficiency.

Conclusion
Dimensity 9400 is set to compete with industry giants like Qualcomm. Phones featuring this chip are expected to launch in late 2024. With its strong AI capabilities, improved performance, and efficiency, MediaTek aims to solidify its position in the premium smartphone market.

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Apple M4 Chip

Apple M4 Chip: Specifications, Performance, and Future in Macs

Apple has unveiled its latest silicon, the Apple M4 chip. Initially launched in the iPad Pro, this new chip is set to power future Macs. Let’s explore what the M4 brings and when we can expect to see it in more Apple devices.

Image credit: Apple
Image credit: Apple

Launch and Availability

Apple introduced the M4 chip during the ‘Let Loose’ event on May 7, 2024. The chip first appeared in iPad Pro models, which started shipping on May 13, 2024. Now, Apple plans to bring the M4 to its Mac lineup. This rollout will begin with the MacBook Pro 14-inch, iMac, and Mac mini, likely as early as October 2024. MacBook Air models are expected to get the chip sometime in 2025. However, Apple may adjust the timeline, and we will know more when new products are officially announced.

Technical Specifications of the M4 Chip

The Apple M4 chip is built on TSMC’s 3nm process, like the M3, but with notable improvements. It features a 10-core CPU, including four performance cores and six efficiency cores, and a 10-core GPU. Compared to the M3’s base version, which had eight cores each for CPU and GPU, this represents a significant upgrade. The M4 also includes a 16-core neural engine that can perform up to 38 trillion operations per second, enhancing AI processing capabilities.

The M4 chip packs 28 billion transistors, up from 25 billion in the M3. It supports up to 128GB of unified memory. Additionally, it maintains support for hardware-accelerated ray tracing, dynamic caching, and mesh shading, similar to the M3 but more refined. New features include support for Tandem OLED displays and hardware-accelerated AV1 media support.

Performance Improvements

Comparing the M4 to the M3 is challenging since the M4 is only in the iPad Pro so far. However, initial tests show promising results. The M4 chip delivers 20% faster CPU performance than the M3. In everyday use, though, this performance boost may not be as noticeable.

When it comes to GPU performance, the M4’s ray-tracing capabilities shine, delivering 13-14% faster results over the M3. The most significant leap appears in neural engine performance, where the M4 is up to 46% faster. This improvement will be crucial for Apple’s future AI development, including its Apple Intelligence projects.

Upcoming Devices and Expectations

Currently, the Apple M4 chip only powers the iPad Pro. However, we anticipate an October 2024 event where Apple will introduce Macs equipped with the M4. Expected devices include the iMac, MacBook Pro, Mac mini, and potentially the MacBook Air. We may not see all these devices at once, but the M4’s expansion to Macs is imminent.

Additionally, Apple might release the M4 Pro and M4 Max soon, possibly by the end of this year. These launches will set the stage for the upcoming holiday season, showcasing the M4 chip’s capabilities in some of the best laptops and desktops available.

The Apple M4 chip promises improved performance across all categories, from CPU and GPU to AI processing. As this new silicon spreads across Apple’s product line, users can expect faster, more efficient devices, perfect for demanding applications and creative work.

Business, Comes Next, Computer Chips, TechNews

AMD RDNA 4 GPUs

AMD RDNA 4 GPUs: Launch Date and What to Expect

Recent leaks suggest AMD will push the launch of its RDNA 4 GPUs to early 2025 (pcgamesn.com). Originally rumored for a late 2024 release, these next-generation graphics cards seem to be slightly behind schedule. Let’s explore what this means for AMD’s lineup and what we can expect from the upcoming RDNA 4 series.

Image credit: AMD
Image credit: AMD

Delayed Launch: What Happened?

According to recent sources, AMD’s RDNA 4 GPUs will arrive in 2025. It will debut with the flagship Navi 48 at CES in January. Earlier rumors suggested a late 2024 release. AMD appears to be holding back the launch of its RDNA 4 GPUs. The company likely wants to clear out existing RDNA 3 inventory before introducing a new generation.

What to Expect from RDNA 4

The RDNA 4 line will include the Navi 44 and Navi 48 GPUs, focusing heavily on value for money, strong performance, and energy efficiency. This approach is different from Nvidia, which continues to prioritize high-performance hardware for its upcoming RTX 5000 series. AMD’s strategy places a greater emphasis on the mid-range market, aiming to offer powerful GPUs at more accessible price points.

With RDNA 4, AMD plans to introduce enhancements like improved raytracing, better clock speeds, GDDR6 memory, and the latest iteration of AMD’s Infinity Cache. These improvements promise a 10-30% performance boost over the current RDNA 3 GPUs. This focus on efficiency and mid-range value could make RDNA 4 an attractive option for many gamers who want performance without breaking the bank.

What Comes Next?

With the RDNA 4 launch now set for 2025, it seems that AMD is aligning itself to compete strongly in the mid-range GPU space. The flagship Navi 48 is expected to be showcased at CES 2025, with the Navi 44 following in Q2. This rollout strategy indicates that AMD wants to target the mid-range and gradually shift towards higher-end models.

Interestingly, while RDNA 4 GPUs promise solid improvements, some enthusiasts may still choose to wait. AMD’s RDNA 5 is already under development and is rumored to include significant architectural changes, possibly catering to the high-end market more than RDNA 4.

Conclusion for AMD RDNA 4 GPUs

AMD’s RDNA 4 GPUs will make their way to the market in early 2025, focusing on delivering value, efficiency, and mid-range power. This delay gives AMD more time to move remaining RDNA 3 stock, while also setting the stage for a strong mid-tier offering next year. With Nvidia pushing ahead with its high-performance RTX 5000 series, 2025 could be a pivotal year for AMD to establish itself as the leader in the mid-range graphics card space. If you’re looking for a balance of performance and cost, the AMD RDNA 4 GPUs might be worth the wait.

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Intel Microcode Update

Intel’s Final Fix: Ending the CPU Crashing Saga with Microcode Update

Intel is rolling out a final microcode update aimed at resolving a persistent CPU crashing issue affecting its 13th and 14th generation Core processors. After identifying excessive voltage requests as a core issue (www.tomshardware.com), Intel, in collaboration with motherboard manufacturers, has developed a comprehensive fix to stabilize performance. This update is critical for preventing further damage and ensuring system stability. Intel encourages all users to install the updated BIOS promptly to benefit from these enhancements and extends warranties to support affected consumers. This move not only resolves the immediate issues but also reinforces Intel’s commitment to product reliability and customer satisfaction.

Image: Intel (Intel 13th Gen Processor)
Image credit: Intel

Intel aims to end the prolonged CPU crashing issue with a crucial microcode update. This saga, marked by several bugs affecting power and voltage, has troubled users of Intel’s high-end 13th and 14th generation Core processors.

Starting in April, Intel explored various potential causes and fixes. The company initially pointed to motherboard manufacturers for setting power levels above the recommended defaults. However, the root cause was identified by summer: CPUs were requesting higher voltages than needed, leading to performance degradation and potential hardware damage.

By August, Intel had released multiple updates to address these issues. These included BIOS updates from motherboard manufacturers to correct power settings and reduce voltage demands. Today, Intel releases a comprehensive 0x12B microcode update. It addresses four critical issues: excessive motherboard defaults, overheating CPUs failing to downshift, and excessive voltage supply during active and idle states.

Motherboard and PC manufacturers will incorporate this new update into their BIOS revisions. Users should install these updates promptly to prevent further damage.

Despite these bugs, only certain Intel CPU models are affected. Intel has extended warranties (arstechnica.com) for these models from three to five years, acknowledging the potential for pre-update damage. Additionally, Intel’s upcoming Arrow Lake desktop processors, manufactured by TSMC, promise freedom from these voltage and stability issues.

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Snapdragon 7s Gen 3

Qualcomm Unveils Snapdragon 7s Gen 3: Mid-Tier Upgrade with Cortex-A720

Qualcomm has launched the its latest SoC for mid-range smartphones. This new chip aims to offer improved performance and power efficiency for budget-friendly devices. Positioned as the entry-level chip in the Snapdragon 7 series, the 7s Gen 3 stands out with significant upgrades.

Image credit: Qualcomm ( Snapdragon 7s Gen 3)
Image credit: Qualcomm ( Snapdragon 7s Gen 3)

Upgraded CPU Performance

The new Snapdragon adopts Arm’s latest Armv9 CPU cores, using a 1+3+4 configuration. This setup includes one prime Cortex-A720 core clocked up to 2.5GHz. Additionally, it features three Cortex-A720 performance cores running at up to 2.4GHz. Four efficiency cores, based on Arm’s A520 design, support lighter tasks and can boost to 1.8GHz. This new architecture replaces the older A78/A55 cores from the previous generation, resulting in a 20% improvement in CPU performance.

Enhanced GPU and AI Capabilities

Qualcomm’s Adreno GPU powers the graphics in the Snapdragon 7s Gen 3. While Qualcomm has not disclosed specific GPU details, they claim a 40% improvement in GPU performance over the 7s Gen 2. This will make gaming and multimedia experiences much smoother.

The chip also features an updated Hexagon NPU for AI tasks. This NPU supports INT4 for low precision inference, enhancing local AI processing. Users can expect a 30% boost in AI performance compared to the previous generation.

Improved Connectivity and Camera Features

The Snapdragon 7s Gen 3 supports both LPDDR4X and LPDDR5 memory. This flexibility allows manufacturers to choose based on the device’s price and performance requirements. The camera system uses a trio of 12-bit Spectra ISPs, supporting a maximum of 64MP resolution with zero shutter lag.

On the connectivity side, Qualcomm has integrated a 5G modem that supports Sub-6 and mmWave bands, with speeds reaching up to 2.9Gbps. The Wi-Fi/Bluetooth module, now branded as FastConnect, supports Wi-Fi 6E and Bluetooth 5.4, providing stable and fast wireless connections.

Efficient Design and Future Devices

Qualcomm has built the new Snapdragon on TSMC’s N4P process. This shift has enhanced power efficiency by 12%, ensuring longer battery life for smartphones. Xiaomi will be the first brand to use this chip in their new phones, with Realme, Sharp, and Samsung expected to follow soon.

The Snapdragon 7s Gen 3 offers an attractive upgrade for mid-range smartphones. It combines enhanced CPU and GPU performance with efficient AI support, making it a strong contender in the mid-tier market.